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United Technologies Corporation Staff Mechancial Engineer - Microelectronics Packaging in Cedar Rapids, Iowa

Job ID: 01352626

City: Cedar Rapids

State: Iowa

Country: United States

Category: Engineering

Job Type: Full Time

Description:

Date Posted:

2019-09-06-07:00

Country:

United States of America

Location:

HIA32: Cedar Rapids, IA 400 Collins Rd NE , Cedar Rapids, IA, 52498-0505 USA

At Collins Aerospace, we’re dedicated to relentlessly tackle the toughest challenges in our industry – all to redefine aerospace.

Created in 2018 through the combination of two leading companies– Rockwell Collins and United Technologies Aerospace Systems – we’re driving the industry forward through technologically advanced and intelligent solutions for global aerospace and defense. Every day we imagine ways to make the skies and the spaces we touch smarter, safer and more amazing than ever. Together we chart new journeys, reunite families, protect nations and save lives. And we do it all with some of the greatest talent this industry has to offer.

We are Collins Aerospace and we hope you join us as we REDEFINE AEROSPACE.

At Collins Aerospace, our Mission Systems team helps civilian, military and government customers complete their most complex missions — whatever and wherever they may be. Our customers depend on us for intelligent and secure communications, missionized systems for specialized aircraft and spacecraft and collaborative space solutions. By joining our team, you’ll have your own critical part to play in ensuring our customer succeeds today while anticipating their needs for tomorrow. Are you up for the challenge? Join our mission today.Collins Aerospace makes modern flight possible. Of course, that wouldn’t be possible without the capabilities and technologies of our organization, as well as our engineers – a highly skilled, accomplished network that spans more than 180 sites, 24 countries and 6 Strategic Business Units (SBUs).

Our industry-leading experts are setting the standards for the aerospace industry and paving the way for the future. But as new challenges present themselves, we need fresh, creative and motivated minds to overcome these hurdles, help us break barriers and achieve new levels of innovation. Do you have what it takes to join a global, diverse organization that doesn’t shy away from big opportunities? If so, we invite you to join our ranks and create the next generation of aerospace technologies.

Together, we will nurture an engineering culture that values intellectual curiosity, risk takers and integrity. A place where we will challenge ourselves, our teams, and the status quo and where we will work to find a way – the right way – to achieve what others can only dream of.

Role Overview

Mission Systems Microelectronics Packaging is seeking to fill a Staff Mechanical Engineering position. This group is responsible for the Microelectronics Packaging technology activities throughout Collins Aerospace. This mechanical engineer will be involved in all aspects of microelectronics packaging design and must possess strong mechanical engineering skills including the desire to design and develop state of the art miniaturized electronic devices.

Primary Responsibilities:

  • Participate in Microelectronics product development activities including packaging concepts, preliminary/detailed board design and package road mapping efforts

  • Develop technologies required for next generation packages

  • Coordinate prototype package builds and evaluation efforts

  • Qualify microelectronic packages

  • Support factory transition of products

  • Provide manufacturing support for Microelectronic assemblies currently in production

Qualifications:

  • Applicant must be capable of obtaining a U.S. Department of Defense (DoD) Security Clearance. (US Citizenship Required)

  • This position requires a Bachelor’s degree in the appropriate discipline and 7 years of relevant experience or an Advanced degree in the appropriate discipline and 5 years of relevant experience. In the absence of a degree, 11 years of relevant experience is required.

  • Candidates for this role should possess a Bachelor’s degree in a Science, Technology, Engineering, or Math (STEM) discipline

  • Effective communication (written, verbal, and interpersonal)

  • Be highly motivated; self-directed; and able to balance multiple tasks

  • Work well within a diverse team environment

  • Working knowledge of mechanical 3D CAD

Experience/Knowledge in some of the following technical areas is required:

  • Microelectronics design and manufacturing assembly

  • Microelectronic packaging materials and material properties

  • Electronic component reliability testing

  • Post wafer fabrication processes

  • Failure analysis techniques

  • Additive Manufacturing

At Collins, the paths we pave together lead to limitless possibility. And the bonds we form – with our customers and with each other -- propel us all higher, again and again.

Some of our competitive benefits package includes:

• Medical, dental, and vision insurance

• Three weeks of vacation for newly hired employees

• Generous 401(k) plan that includes employer matching funds and separate employer retirement contribution

• Tuition reimbursement

• Life insurance and disability coverage

• And more

Apply now and be part of the team that’s redefining aerospace, every day.

United Technologies Corporation is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.

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Qualification:

United Technologies Corporation is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other federally protected class.

Thank you for your interest in a career at United Technologies! We will soon upgrade to an improved job application system to simplify the apply experience. You will still be able to apply to any of our current job openings through December 18, 2018. On January 2, 2019, our new and improved job application system will launch; please check back on that date to see all of our job openings.

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